Electroplating
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Up to 12 inches/300mm wafers
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Large panel size electroplating possible
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DPC: Direct Plating Copper
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Cu, Ni, Au, AuSn, etc. electroplating.
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Electroless plating for non-conductors using sputtered seed layers
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Cu TSV (Through Silicon Via) fill
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Cu TGV (Through glass Via) fill
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Conformal TSV (Through Silicon Via)/ TGV(Through Glass Via) plating
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Metal and solder electroplating
Electroforming
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Fabrication of 3D metal solid structures using polymer or resist structures formed by X-ray lithography.
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X-ray lithography with electroforming and molding know as the LIGA process.
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High aspect ratio structures
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Diameter as small as 1um, as thin s 20um
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Huge applications in life sciences with biocompatible materials
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Materials: Ni, Pd-Ni, Ni-Co
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Applications
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Fabrication of Nickel molds/ masters for nanoimprinting/ injection molding
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Microfilters
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Micro meshes/ filters
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Nebulizer for mist generation
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Microlens array
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Metal masks
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Gratings
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Micropore membranes
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Microneedles
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Microfluidic chips